
High‑performance PCB layout and thermal design
High-performance modular power systems achieve higher levels of flexibility and scalability than ground-up custom designs. Our continual advances in power distribution architectures, conversion topologies and packaging technology will keep you ahead in system efficiency and density, converting and managing power from the source to the point-of-load.
High‑performance PCB layout and thermal design
Attributes of high‑performance power module packaging
Power averaging saves cost for weaving looms
Reliable operation in a tough environment for ore prospecting instrumentation